Assurance of printed circuit boards using machine vision

HMGCC Co-Creation seeks organisations for a five-month project developing ways to robustly assure printed circuit boards (PCBs).

Opportunity Details

When

Registration Opens

15/07/2024

Registration Closes

29/08/2024

Award

Selected solution(s) will be trialled in pilot studies, with the possibility of further adoption upon successful trials, co-developed with the challenge holder. Funding of up to £80,000 is available per single successful organisation.

Organisation

HMGCC

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When national security organisations use electronic equipment in sensitive environments, they must be sure every element has been properly assured. In its latest challenge, HMGCC (His Majesty’s Government Communications Centre) Co-Creation wants organisations to get involved in a five-month project, developing ways to robustly assure printed circuit boards (PCBs). The innovative methods used need to image and verify the complete manufactured PCB stack-up, providing assurance they will function where and when they are most needed. HMGCC Co-Creation will provide funding for time, material, overheads, and other indirect expenses.

The challenge

All organisations associated with national security undertake sensitive and classified daily tasks, and there is the invariable need to use electronic equipment. Sensitive equipment may be sourced from a range of suppliers varying from bespoke construction by HMGCC to less well-established third-party routes. With all routes, there is a requirement to conduct due diligence on the constituent parts of an electronic system – ensuring functionality and security.

The focus of this challenge is to non-destructively image and verify printed circuit boards (PCB), specifically focusing on analysing copper traces through both the external and internal stack-up layers of complex multi-layer FR4 PCBs. Further technical details of requirements are available at the Innovation Exchange site at the link below.

Proposals should be focused on a proof of concept at Technology Readiness Level (TRL) 2-4, to be demonstrated towards the end of the five- month project, with a view to further development in future phases of work.

Desirable functions:

  • Method can image copper traces throughout multi-layered FR4 based PCBs.
  • Method works around possible shadowing or blocking effect from attached components.
  • Machine vision and machine learning processes to interpret images.
  • Direct and easy comparison of imaged PCB against original design files.
  • Easy to use and minimal training required.
  • Reasonably fast process (less than one day per PCB).
  • Equipment must be useable within a normal lab setting, i.e. not be prohibitively large or hazardous.

What we don’t want:

  • Horizon scanning
  • Report of theoretical techniques
  • Technology available more than 5 years from now

Who can apply?

This challenge is open to sole innovators, industry, academic and research organisations of all types and sizes. There is no requirement for security clearances.

Solution providers or direct collaboration from countries listed by the UK government under trade sanctions and/or arms embargoes, are not eligible for HMGCC Co-Creation challenges.

View the terms and conditions for the challenge here.

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